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PCF210AA Datasheet(PDF) 45 Page - NXP Semiconductors |
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PCF210AA Datasheet(HTML) 45 Page - NXP Semiconductors |
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45 / 63 page ![]() PCF2123 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 27 April 2011 45 of 63 NXP Semiconductors PCF2123 SPI Real time clock/calendar 15. Package outline Fig 30. Package outline SOT758-1 (HVQFN16) of PCF2123BS/1 terminal 1 index area 0.5 1 A1 Eh b UNIT y e 0.2 c REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 3.1 2.9 Dh 1.75 1.45 y1 3.1 2.9 1.75 1.45 e1 1.5 e2 1.5 0.30 0.18 0.05 0.00 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT758-1 MO-220 - - - - - - 0.5 0.3 L 0.1 v 0.05 w 0 2.5 5 mm scale SOT758-1 HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm A(1) max. A A1 c detail X y y1 C e L Eh Dh e e1 b 58 16 13 12 9 4 1 X D E C B A e2 02-03-25 02-10-21 terminal 1 index area 1/2 e 1/2 e A C C B v M w M E(1) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. D(1) |
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