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ADP2127 Datasheet(PDF) 17 Page - Analog Devices |
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ADP2127 Datasheet(HTML) 17 Page - Analog Devices |
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17 / 20 page ![]() ADP2126/ADP2127 Rev. A | Page 17 of 20 OUTLINE DIMENSIONS 0.40 REF 0.80 REF 1.340 1.300 1.260 0.940 0.900 0.860 0.40 REF A 1 2 B C TOP VIEW (BALL SIDE DOWN) BOTTOM VIEW (BALL SIDE UP) BALL A1 IDENTIFIER 0.225 TYP 0.09 TYP 0.330 0.315 0.300 END VIEW 0.190 0.170 0.150 COPLANARITY 0.05 NOM SEATING PLANE Figure 33. 6-Ball Bumped Bare Die Sales [BUMPED_CHIP] (CD-6-4) Dimensions shown in millimeters 0.40 REF 0.80 REF 1.340 1.300 1.260 0.940 0.900 0.860 SEATING PLANE 0.200 0.175 0.150 A 1 2 B C TOP VIEW (PAD SIDE DOWN) BOTTOM VIEW (PAD SIDE UP) 0.17 DIA. DETAIL A BARE Cu FIDUCIAL 0.15 DIA. DETAIL A ROTATED 90° CCW 0.008 MIN 0.40 PAD PITCH 0.13 DIA. Figure 34. 6-Pad Embedded Wafer Level Package [EWLP] (CN-6-1) Dimensions shown in millimeters DIRECTION OF FEED THE ADP2126 HAS AN A1 BALL IDENTIFIER THAT IS VISIBLE ON THE TOP OF THE PART. THE ADP2127 HAS NO VISIBLE MARKING ON THE TOP, BUT THE A1 PIN LOCATION IS THE SAME. 1 A B C 2 Figure 35. Tape and Reel Orientation for ADP2126/ADP2127 |
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