TMS320F2812 datasheet(90/170 Pages) TI

90 / 170 page

TMS320F2810, TMS320F2811, TMS320F2812

TMS320C2810, TMS320C2811, TMS320C2812

SPRS174S – APRIL 2001 – REVISED MARCH 2011

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Electrical Specifications

This section provides the absolute maximum ratings and the recommended operating conditions for the

TMS320F281x and TMS320C281x DSPs.

6.1

Absolute Maximum Ratings

(1)

Supply voltage range (VDDIO, VDD3VFL, VDDA1, VDDA2, VDDAIO, and AVDDREFBG)

–0.3 V to 4.6 V

Supply voltage range (VDD, VDD1)

–0.5 V to 2.5 V

Input voltage range, VIN

–0.3 V to 4.6 V

Output voltage range, VO

–0.3 V to 4.6 V

Input clamp current, IIK (VIN < 0 or VIN > VDDIO)

(2)

±20 mA

Output clamp current, IOK (VO < 0 or VO > VDDIO)

±20 mA

Operating ambient temperature ranges, TA

A version (GHH, ZHH, PGF, PBK)(3)

–40°C to 85°C

S version (GHH, ZHH, PGF, PBK)(3)

–40°C to 125°C

Q version (PGF, PBK)(3)

–40°C to 125°C

Junction temperature range, TJ

–40°C to 150°C

Storage temperature range, Tstg

(3)

–65°C to 150°C

(1)

Unless otherwise noted, the list of absolute maximum ratings are specified over operating temperature ranges. Stresses beyond those

listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated under Section 6.2, Recommended Operating Conditions,

is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are

with respect to VSS.

(2)

Continuous clamp current per pin is ±2 mA

(3)

Long-term high-temperature storage and/or extended use at maximum temperature conditions may result in a reduction of overall device

life. For additional information, see the IC Package Thermal Metrics Application Report (literature number SPRA953) and the Reliability

Data for TMS320LF24xx and TMS320F28xx Devices Application Report (literature number SPRA963).

6.2

Recommended Operating Conditions

(1)

MIN

NOM

MAX

UNIT

VDDIO

Device supply voltage, I/O

3.14

3.3

3.47

1.8 V (135 MHz)

1.71

1.8

1.89

VDD, VDD1

Device supply voltage, CPU

1.9 V (150 MHz)

1.81

1.9

VSS

Supply ground

VDDA1, VDDA2,

ADC supply voltage

3.14

3.3

3.47

AVDDREFBG,

VDDAIO

VDD3VFL

Flash programming supply voltage

3.14

3.3

3.47

fSYSCLKOUT

Device clock frequency

VDD = 1.9 V ± 5%

150

MHz

(system clock)

VDD = 1.8 V ± 5%

135

VIH

High-level input voltage

All inputs except X1/XCLKIN

VDDIO

X1/XCLKIN (@ 50 µA max)

0.7VDD

VDD

VIL

Low-level input voltage

All inputs except X1/XCLKIN

0.8

X1/XCLKIN (@ 50 µA max)

0.3VDD

IOH

High-level output source current,

All I/Os except Group 2

–4

VOH = 2.4 V

Group 2(2)

–8

IOL

Low-level output sink current,

All I/Os except Group 2

VOL = VOL MAX

Group 2(2)

Ambient temperature

A version

–40

S version

–40

125

°C

Q version

–40

125

(1)

See Section 6.8 for power sequencing of VDDIO, VDDAIO, VDD, VDDA1/VDDA2/AVDDREFBG, and VDD3VFL.

(2)

Group 2 pins are as follows: XINTF pins, T1CTRIP_PDPINTA, TDO, XCLKOUT, XF, EMU0, and EMU1.

Electrical Specifications

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