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LPC4350 Datasheet(PDF) 135 Page - NXP Semiconductors |
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LPC4350 Datasheet(HTML) 135 Page - NXP Semiconductors |
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135 / 145 page ![]() LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 2.1 — 23 September 2011 135 of 145 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Fig 50. Reflow soldering of the LQFP208 package SOT459-1 DIMENSIONS in mm occupied area Footprint information for reflow soldering of LQFP208 package Ax Bx Gx Gy Hy Hx Ay By P1 P2 D2 (8 ×) D1 (0.125) Ax Ay Bx By D1 D2 Gx Gy Hx Hy P1 P2 C sot459-1_fr solder land C Generic footprint pattern Refer to the package outline drawing for actual layout 31.300 31.300 28.300 28.300 0.500 0.560 0.280 1.500 0.400 28.500 28.500 31.550 31.550 |
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