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LPC4350 Datasheet(PDF) 137 Page - NXP Semiconductors |
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LPC4350 Datasheet(HTML) 137 Page - NXP Semiconductors |
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137 / 145 page ![]() LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 2.1 — 23 September 2011 137 of 145 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Fig 52. Reflow soldering of the TFBGA100 package DIMENSIONS in mm PSL SP SR Hx Hy Hx Hy SOT926-1 solder land plus solder paste occupied area Footprint information for reflow soldering of TFBGA100 package solder land solder paste deposit solder resist P P SL SP SR Generic footprint pattern Refer to the package outline drawing for actual layout detail X see detail X sot926-1_fr 0.80 0.330 0.400 0.480 9.400 9.400 |
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