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LPC4350 Datasheet(PDF) 138 Page - NXP Semiconductors |
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LPC4350 Datasheet(HTML) 138 Page - NXP Semiconductors |
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138 / 145 page ![]() LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 2.1 — 23 September 2011 138 of 145 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Fig 53. Reflow soldering of the LQFP100 package SOT407-1 DIMENSIONS in mm occupied area Footprint information for reflow soldering of LQFP100 package Ax Bx Gx Gy Hy Hx Ay By P1 P2 D2 (8 ×) D1 (0.125) Ax Ay Bx By D1 D2 Gx Gy Hx Hy P1 P2 C sot407-1 solder land C Generic footprint pattern Refer to the package outline drawing for actual layout 17.300 17.300 14.300 14.300 0.500 0.560 0.280 1.500 0.400 14.500 14.500 17.550 17.550 |
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