CMA3000 Assembly Instructions

TABLE OF CONTENTS

1

Objective ............................................................................................................................... 3

2

VTI's 3D Stacked Wafer Level Chip-on-MEMS Package (CoM) ........................................ 3

3

CMA3000 CoM Package Outline and Dimensions ............................................................. 4

4

Packing ................................................................................................................................. 6

4.1

Tape and Reel Specifications .................................................................................................. 6

4.2

Reel packing and outer box ..................................................................................................... 8

5

Printed Wiring Board (PWB) Level Guidelines .................................................................. 9

5.1

PWB layout ................................................................................................................................9

5.2

Solder Paste ............................................................................................................................ 10

5.3

Stencil ...................................................................................................................................... 10

5.4

Paste Printing.......................................................................................................................... 11

5.5

Component Picking ................................................................................................................ 11

5.6

Component Placement ........................................................................................................... 11

5.7

Reflow Soldering..................................................................................................................... 11

5.8

Moisture sensitivity level (MSL) classification..................................................................... 13

5.9

Inspection ................................................................................................................................13

6

Rework Guidelines ............................................................................................................. 15

6.1

Preparations ............................................................................................................................ 15

6.2

Component removal ............................................................................................................... 15

6.3

PWB cleaning .......................................................................................................................... 15

6.4

Component reuse ................................................................................................................... 15

6.5

Applying flux or solder paste ................................................................................................ 15

6.6

Component placement ........................................................................................................... 16

6.7

Reflow soldering ..................................................................................................................... 16

7

Hand Soldering Guidelines ............................................................................................... 16

8

Environmental Aspects ..................................................................................................... 16

9

Effect of the Reflow Soldering .......................................................................................... 16

10 References.......................................................................................................................... 18

11 Document Revision History .............................................................................................. 18

Subject to changes

TN68

2/18

Rev.09

PRELIMINARY

VTI Technologies Oy

www.vti.fi