CMA3000 Assembly Instructions

5.8

Moisture sensitivity level (MSL) classification

The Moisture Sensitivity Level of the CMA3000 component is Level 2 according to the IPC/JEDEC

J-STD-020D. The part is delivered in a dry pack. The manufacturing floor time (out of bag) at the

customer’s end is 1 year. Maximum soldering peak temperature for the CMA3000 component is

260

°C and maximum time above 255°C is 30sec, measured from the package body, as specified

in IPC/JEDEC J-STD-020D.

5.9

Inspection

The CMA3000 component's solder joint quality can be inspected with similar methods as any other

solder sphered SMD component. Optical and visual inspection can be done only partly, since the

solder spheres are located beneath the component. However, the visual inspection is

recommended for checking the proper alignment and level of the component. X-ray inspection is

recommended for checking voids, solder bridges, and short-circuits between the solder joints.

Cross-sectional analysis is also an approved method for inspection of metallurgical integrity and

wettability of the solder joints. An example of properly soldered CMA3000 component is illustrated

in Figure 10.

Figure 11.

SEM-image of a properly soldered CMA3000 component.

Subject to changes

TN68

13/18

Rev.09

PRELIMINARY

VTI Technologies Oy

www.vti.fi