CMA3000 Assembly Instructions

Figure 10.

Typical convection reflow soldering phases and profile (IPC/JEDEC J-STD-020C table

5-2 and figure 5-1).

The process window for lead-free soldering is narrower than for traditional eutectic SnPb solders.

Thus, caution has to be taken care when adjusting the reflow profiles. The reflow profile should be

measured using a thermo-couple measurement system. It is recommended that at least three

thermo-couples are used, depending on the application. As a general guide, one thermo-couple

should be placed under a component having the largest thermal mass, one next to the smallest

component, one should be in contact with CMA3000 component's solder joint, and others to the

appropriate spots on a circuit board, e.g. corner, center, bottom of the board etc. The reflow profile

should be adjusted according to the measured data so that each solder joint experiences an

optimal reflow profile. The temperature gradient should be as small as possible across the

circuit board and the components. Extreme caution has to be taken if the circuit board

contains components with vastly different thermal masses.

Underfilling of the CMA3000 is not recommended. This can affect on the component performance.

Subject to changes

TN68

12/18

Rev.09

PRELIMINARY

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www.vti.fi