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AFS090 Datasheet(PDF) 319 Page - Microsemi Corporation

Part # AFS090
Description  Fusion Family of Mixed Signal FPGAs
PDF  334 Pages
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

AFS090 Datasheet(HTML) 319 Page - Microsemi Corporation

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Fusion Family of Mixed Signal FPGAs
R e visio n 2
5 -3
Revision 2
(continued)
The following notes were removed from Table 2-168 • Minimum and Maximum DC
Input and Output Levels (SAR 34808):
±5%
Differential input voltage = ±350 mV
2-211
An incomplete, duplicate sentence was removed from the end of the "GNDAQ
Ground (analog quiet)" pin description (SAR 30185).
2-225
Information about configuration of unused I/Os was added to the "User Pins" section
(SAR 32642).
2-227
The following information was added to the pin description for "XTAL1 Crystal
Oscillator Circuit Input" and "XTAL2 Crystal Oscillator Circuit Input" (SAR 24119).
2-229
The input resistance to ground value in Table 3-3 • Input Resistance of Analog Pads
for Analog Input (direct input to ADC), was corrected from 1 M
Ω (typical) to 2 kΩ
(typical) (SAR 34371). The prescalar range for the 'Analog Input (direct input to
ADC)" configurations was removed as inapplicable for direct inputs. The input
resistance for direct inputs is covered in Table 2-50 • ADC Characteristics in Direct
Input Mode (SAR 31201).
3-4
The Storage Temperature column in Table 3-5 • FPGA Programming, Storage, and
Operating Limits stated Min. TJ twice for commercial and industrial product grades
and has been corrected to Min. TJ and Max. TJ (SAR 29416).
3-5
The reference to guidelines for global spines and VersaTile rows, given in the
"Global Clock Dynamic Contribution—PCLOCK" section, was corrected to the "Spine
Architecture" section of the Global Resources chapter in the Fusion FPGA
Fabric User's Guide
(SAR 34741).
3-24
Package names used in the "Package Pin Assignments" section were revised to
match standards given in Package Mechanical Drawings (SAR 36612).
4-1
July 2010
The versioning system for datasheets has been changed. Datasheets are assigned
a revision number that increments each time the datasheet is revised. The "Fusion
Device Status" table indicates the status for each device in the device family.
N/A
v2.0, Revision 1
(July 2009)
The MicroBlade and Fusion datasheets have been combined. Pigeon Point
information is new.
CoreMP7 support was removed since it is no longer offered.
–F was removed from the datasheet since it is no longer offered.
The operating temperature was changed from ambient to junction to better reflect
actual conditions of operations.
Commercial: 0°C to 85°C
Industrial: –40°C to 100°C
The version number category was changed from Preliminary to Production, which
means the datasheet contains information based on final characterization. The
version number changed from Preliminary v1.7 to v2.0.
N/A
The "Integrated Analog Blocks and Analog I/Os" section was updated to include a
reference to the "Analog System Characteristics" section in the Device Architecture
chapter of the datasheet, which includes Table 2-46 • Analog Channel Specifications
and specific voltage data.
1-4
The phrase "Commercial-Case Conditions" in timing table titles was changed to
"Commercial Temperature Range Conditions."
N/A
The "Crystal Oscillator" section was updated significantly. Please review carefully.
2-21
Revision
Changes
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