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AFS090 Datasheet(PDF) 319 Page - Microsemi Corporation |
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AFS090 Datasheet(HTML) 319 Page - Microsemi Corporation |
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319 / 334 page ![]() Fusion Family of Mixed Signal FPGAs R e visio n 2 5 -3 Revision 2 (continued) The following notes were removed from Table 2-168 • Minimum and Maximum DC Input and Output Levels (SAR 34808): ±5% Differential input voltage = ±350 mV 2-211 An incomplete, duplicate sentence was removed from the end of the "GNDAQ Ground (analog quiet)" pin description (SAR 30185). 2-225 Information about configuration of unused I/Os was added to the "User Pins" section (SAR 32642). 2-227 The following information was added to the pin description for "XTAL1 Crystal Oscillator Circuit Input" and "XTAL2 Crystal Oscillator Circuit Input" (SAR 24119). 2-229 The input resistance to ground value in Table 3-3 • Input Resistance of Analog Pads for Analog Input (direct input to ADC), was corrected from 1 M Ω (typical) to 2 kΩ (typical) (SAR 34371). The prescalar range for the 'Analog Input (direct input to ADC)" configurations was removed as inapplicable for direct inputs. The input resistance for direct inputs is covered in Table 2-50 • ADC Characteristics in Direct Input Mode (SAR 31201). 3-4 The Storage Temperature column in Table 3-5 • FPGA Programming, Storage, and Operating Limits stated Min. TJ twice for commercial and industrial product grades and has been corrected to Min. TJ and Max. TJ (SAR 29416). 3-5 The reference to guidelines for global spines and VersaTile rows, given in the "Global Clock Dynamic Contribution—PCLOCK" section, was corrected to the "Spine Architecture" section of the Global Resources chapter in the Fusion FPGA Fabric User's Guide (SAR 34741). 3-24 Package names used in the "Package Pin Assignments" section were revised to match standards given in Package Mechanical Drawings (SAR 36612). 4-1 July 2010 The versioning system for datasheets has been changed. Datasheets are assigned a revision number that increments each time the datasheet is revised. The "Fusion Device Status" table indicates the status for each device in the device family. N/A v2.0, Revision 1 (July 2009) The MicroBlade and Fusion datasheets have been combined. Pigeon Point information is new. CoreMP7 support was removed since it is no longer offered. –F was removed from the datasheet since it is no longer offered. The operating temperature was changed from ambient to junction to better reflect actual conditions of operations. Commercial: 0°C to 85°C Industrial: –40°C to 100°C The version number category was changed from Preliminary to Production, which means the datasheet contains information based on final characterization. The version number changed from Preliminary v1.7 to v2.0. N/A The "Integrated Analog Blocks and Analog I/Os" section was updated to include a reference to the "Analog System Characteristics" section in the Device Architecture chapter of the datasheet, which includes Table 2-46 • Analog Channel Specifications and specific voltage data. 1-4 The phrase "Commercial-Case Conditions" in timing table titles was changed to "Commercial Temperature Range Conditions." N/A The "Crystal Oscillator" section was updated significantly. Please review carefully. 2-21 Revision Changes Page |
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