ABSOLUTE MAXIMUM RATINGS

(1)

ADS774H

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

SPECIFIED

LINEARITY

PACKAGE-

PACKAGE

TEMPERATURE

ORDERING

TRANSPORT

PRODUCT

ERROR

LEAD

DESIGNATOR

RANGE

NUMBER

MEDIA, QUANTITY

NT

–40°C to +85°C

ADS774HIBNT

Rail, 13

70dB

±1/2 LSB

NTD

–40°C to +85°C

ADS774HIBNTD

Rail, 13

ADS774HIB

(High-Grade)

ADS774HIBDW

Tape and Reel, 28

70dB

±1/2 LSB

SO-28

DW

–40°C to +85°C

ADS774HIBEDWR

Tape and Reel, 1000

NT

–40°C to +85°C

ADS774HINTD

Rail, 13

68dB

±1LSB

NTD

–40°C to +85°C

ADS774HINT

Rail, 13

ADS774HI

(Standard-Grade)

ADS774HIDW

Tape and Reel, 28

68dB

±1LSB

SO-28

DW

–40°C to +85°C

ADS774HIDWR

Tape and Reel, 1000

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

SINAD is Signal-to-(Noise + Distortion) expressed in dB.

(3)

DIP-28 package is product preview.

Over operating free-air temperature range (unless otherwise noted).

ADS774H

UNIT

V

0 to +7

V

Analog Common to Digital Common

±1

V

V

Analog inputs (REF IN, Bipolar Offset, 10V Range) to Analog Common

±16.5

V

20V Range to Analog Common

±24

V

Indefinite short to common,

Ref Out

Maximum junction temperature

+165

°C

Power dissipation

1000

mW

Lead temperature (soldering, 10s)

+300

°C

DIP-28

Thermal impedance,

100

°C/W

θ

JA

SO-28

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to

absolute-maximum-rated conditions for extended periods may affect device reliability.

2

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