CDCLVD1213 datasheet(4/17 Pages) TI1

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CDCLVD1213

SCAS897 – JULY 2010

www.ti.com

THERMAL INFORMATION

CDCLVD1213

THERMAL METRIC(1)

UNITS

RGT(16 PINS)

qJA

Junction-to-ambient thermal resistance

51.3

qJC(top)

Junction-to-case(top) thermal resistance

85.4

qJB

Junction-to-board thermal resistance

20.1

°C/W

yJT

Junction-to-top characterization parameter

1.3

yJB

Junction-to-board characterization parameter

19.4

qJC(bottom)

Junction-to-case(bottom) thermal resistance

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

ELECTRICAL CHARACTERISTICS

At VCC = 2.375 V to 2.625 V and TA = –40°C to 85°C (unless otherwise noted).

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

DIVIDER CONTROL INPUT (DIV) CHARACTERISTICS

VdI3

3-State

Open

0.5×VCC

VdIH

Input high voltage

0.7×VCC

VdIL

Input low voltage

0.2×VCC

IdIH

Input high current

VCC = 2.625 V, VIH = 2.625 V

IdIL

Input low current

VCC = 2.625 V, VIL = 0 V

–30

Rpull(DIV)

Input pull-up/ pull-down resistor

200

DIFFERENTIAL INPUTS (INP, INN) CHARACTERISTICS

fIN

Input frequency

Clock input

800

MHz

Differential input voltage

VIN, DIFF

VICM = 1.25 V

0.3

1.6

VPP

peak-to-peak

VICM

Input common-mode voltage range

VCC – 0.3

RIN

Input termination

INP, INN to VT, DC

IIH

Input high current

VCC = 2.625 V, VIH = 2.625 V

IIL

Input low current

VCC = 2.625 V, VIL = 0 V

–10

ΔV/ΔT

Input edge rate

20% to 80%

0.75

V/ns

CIN

Input capacitance

2.5

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