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DDC264 Datasheet(PDF) 2 Page - Texas Instruments |
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DDC264 Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 26 page ![]() DDC264 SBAS368C – MAY 2006 – REVISED JULY 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DDC FAMILY OVERVIEW MAXIMUM PACKAGE- PRODUCT NO. OF CHANNELS FULL-SCALE DATA RATE POWER/CHANNEL LEAD DDC112 2 1000pC 20kSPS 40mW SO-28 DDC112K 2 1000pC 3.3kSPS 40mW TQFP-32 DDC114 4 350pC 3.3kSPS 13mW QFN-48 DDC118 8 350pC 3.3kSPS 13mW QFN-48 DDC316 16 12pC 100kSPS 28mW BGA-64 DDC232C 32 350pC 3.1kSPS 7mW BGA-64 DDC232CK 32 350pC 6.2kSPS 10mW BGA-64 DDC264C 64 150pC 3.1kSPS 3mW BGA-100 DDC264CK 64 150pC 6.2kSPS 5.5mW BGA-100 ORDERING INFORMATION For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) AVDD to AGND –0.3V to +6V DVDD to DGND –0.3V to +3.6V AGND to DGND ±0.2V VREF Input to AGND 2.0V to AVDD + 0.3V Analog Input to AGND –0.3V to +0.7V Digital Input Voltage to DGND –0.3V to DVDD + 0.3V Digital Output Voltage to DGND –0.3V to DVDD + 0.3V Operating Temperature 0 °C to +70°C Storage Temperature –60°C to +150°C Junction Temperature (TJ) +150 °C Human Body Model (HBM) 4kV JEDEC standard 22, test method A114-C.01, all pins ESD Ratings: Charged Device Model (CDM) 1kV JEDEC standard 22, test method A114-C.01, all pins (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. 2 Copyright © 2006–2011, Texas Instruments Incorporated |
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