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ISO35T Datasheet(PDF) 12 Page - Texas Instruments

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Part # ISO35T
Description  Isolated 3.3V RS-485 Transceiver With Integrated Transformer Driver
PDF  25 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

ISO35T Datasheet(HTML) 12 Page - Texas Instruments

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0
100
200
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0
50
100
150
200
T - Case Temperature - °C
C
V
= V
= 3.6 V
CC1
CC2
ISO35T
SLLSE26C
– NOVEMBER 2010 – REVISED AUGUST 2011
www.ti.com
REGULATORY INFORMATION
VDE
UL
Certified according to DIN EN 60747-5-2 (VDE 0884 Part 2)
Recognized under 1577 Component Recognition Program
Basic Insulation
Single / Basic Isolation Voltage, 2500 VRMS
(1)
Maximum Transient Overvoltage, 4242 VPK
Maximum Surge Voltage, 4242 VPK
Maximum Working Voltage, 566 VPK
File Number: 40016131 (Approval Pending)
File Number: E181974 (Approval Pending)
(1)
Production tested
≥ 3000 VRMS for 1 second in accordance with UL 1577.
IEC SAFETY LIMITING VALUES
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.
A failure of the IO can allow low resistance to ground or the supply. Without current limiting, sufficient power is
dissipated to overheat the die; and, damage the isolation barrier
—potentially leading to secondary system
failures.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
IS
Safety input, output, or supply current
θJA = 80.5°C/W, VI = 3.6V, TJ = 170°C, TA = 25°C
500
mA
DW-16
TS
Maximum case temperature
150
°C
The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum
ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the
application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the
Thermal Characteristics table is that of a device installed on the High-K Test Board for Leaded Surface Mount
Packages. The power is the recommended maximum input voltage times the current. The junction temperature is
then the ambient temperature plus the power times the junction-to-air thermal resistance.
Figure 15. DW-16
θJC Thermal Derating Curve per IEC 60747-5-2
12
Copyright
© 2010–2011, Texas Instruments Incorporated



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