REV. 0

AD8326

–5–

ORDERING GUIDE

Model

Temperature Range

Package Description

JA

Package Option

AD8326ARP

–40

°C to +85°C

28-Lead Power SOIC with Slug

23

°C/W*

RP-28

AD8326ARP-REEL

AD8326ARP-EVAL

Evaluation Board

AD8326ARE

–40

°C to +85°C

28-Lead TSSOP with Exposed Pad

39

°C/W*

RE-28

AD8326ARE-REEL

AD8326ARE-EVAL

Evaluation Board

*Thermal Resistance measured on SEMI standard 4-layer board.

ABSOLUTE MAXIMUM RATINGS

*

Input Voltages

Pins 25, 26 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±0.5 V

Pins 1, 2, 3, 6, 7 . . . . . . . . . . . . . . . . . . . . . –0.8 V to +5.5 V

Internal Power Dissipation

TSSOP EPAD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 W

PSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.0 W

Operating Temperature Range . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Lead Temperature, Soldering 60 seconds . . . . . . . . . . . 300

°C

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the AD8326 features proprietary ESD protection circuitry, permanent damage may occur on

devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are

recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE