MRF6V2150NR1 MRF6V2150NBR1

17

RF Device Data

Freescale Semiconductor

PRODUCT DOCUMENTATION AND SOFTWARE

Refer to the following documents to aid your design process.

Application Notes

• AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages

• AN1955: Thermal Measurement Methodology of RF Power Amplifiers

• AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over--Molded Plastic Packages

Engineering Bulletins

• EB212: Using Data Sheet Impedances for RF LDMOS Devices

Software

• Electromigration MTTF Calculator

• RF High Power Model

For Software, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the Software &

Tools tab on the part’s Product Summary page to download the respective tool.

REVISION HISTORY

The following table summarizes revisions to this document.

Revision

Date

Description

0

Feb. 2007

• Initial Release of Data Sheet

1

May 2007

• Corrected Test Circuit Component part numbers in Table 6, Component Designations and Values for C4,

C17, C5, C18, C9, C12, C14, C23, C13, C21, and C22, p. 3

2

Apr. 2008

• Added Case Operating Temperature limit to the Maximum Ratings table and set limit to 150°C, p. 1

Dynamic Characteristics table, p. 2

• Updated PCB information to show more specific material details, Fig. 2, Test Circuit Schematic, p. 3

• Updated Part Numbers in Table 6, Component Designations and Values, to latest RoHS compliant part

numbers, p. 3

• Replaced Case Outline 1486--03, Issue C, with 1486--03, Issue D, p. 8--10. Added pin numbers 1 through 4

on Sheet 1.

• Replaced Case Outline 1484--04, Issue D, with 1484--04, Issue E, p. 11--13. Added pin numbers 1 through

4 on Sheet 1, replacing Gate and Drain notations with Pin 1 and Pin 2 designations.

3

Dec. 2008

• Added Typical Performances table for 27 MHz, 450 MHz applications, p. 2

• Added Figs. 15 and 16, Test Circuit Component Layout -- 27 MHz and 450 MHz, and Tables 7 and 8, Test

Circuit Component Designations and Values -- 27 MHz and 450 MHz, p. 8, 9

• Added Fig. 17, Series Equivalent Source and Load Impedance for 27 MHz, 450 MHz, p. 10

4

Apr. 2010

• Operating Junction Temperature increased from 200°C to 225°C in Maximum Ratings table, related

“Continuous use at maximum temperature will affect MTTF” footnote added and changed 200°C to 225°C

in Capable Plastic Package bullet, p. 1

• Added Electromigration MTTF Calculator and RF High Power Model availability to Product Software,

p. 17