AD8605/AD8606/AD8608

Rev. D | Page 6 of 20

ABSOLUTE MAXIMUM RATINGS

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those listed in the operational sections

of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Table 3.

Parameter

Rating

Supply Voltage

6 V

Input Voltage

Differential Input Voltage

6 V

Output Short-Circuit Duration

to GND

Observe Derating Curves

Storage Temperature Range

All Packages

−65°C to +150°C

Operating Temperature Range

AD8605/AD8606/AD8608

−40°C to +125°C

Junction Temperature Range

All Packages

−65°C to +150°C

Lead Temperature Range

(Soldering, 60 sec)

300°C

Table 4. Package Type

Package Type

Unit

5-Bump MicroCSP (CB)

220

220

°C/W

5-Lead SOT-23 (RT)

230

92

°C/W

8-Lead MSOP (RM)

210

45

°C/W

8-Lead SOIC (R)

158

43

°C/W

14-Lead SOIC (R)

120

36

°C/W

14-Lead TSSOP (RU)

180

35

°C/W

socket for PDIP packages;

board for surface-mount packages.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.