Rev. 00

Rev. 00

September 2009

September 2009

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Reflow Soldering Conditions/ Profile

• Preliminary heating to be at 150℃max. for 2 minutes max.

• Soldering heat to be at 240℃max. for 5 seconds max.

(1) Lead Solder

• Preliminary heating to be at 150℃max. for 2 minutes max.

• Soldering heat to be at 260℃max. for 10 seconds max.

(2) Lead-Free Solder

• Not more than 1 seconds @MAX280℃, under Soldering iron.

(3) Hand Soldering Condition

[Note] In case the soldered products are reused in soldering process, Seoul Semiconductor can not guarantee the

performance of the products.

Temperature

rise: 5°C/sec.

-5°C/sec.

Cooling:

Pre-heating

Operation heating

60 to 120 sec.

5sec. max

120

150

240

°C

0

120

60 to 120 sec.

0

260

150

°C

10 sec.

Operation heating

-5°C/sec.

Cooling:

Pre-heating

rise: 5°C/sec.[Max]

Temperature

5. Soldering Profile