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SBAS052 Datasheet(PDF) 3 Page - Texas Instruments

Part # SBAS052
Description  Stereo Audio DIGITAL-TO-ANALOG CONVERTER MPEG2/AC-3 COMPATIBLE
PDF  17 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

SBAS052 Datasheet(HTML) 3 Page - Texas Instruments

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®
PCM1720
3
PIN ASSIGNMENTS
PIN
NAME
TYPE
FUNCTION
1
NC
—
No Connection.
2
SCKI
IN
System Clock Input: 256fS or 384fS.
3
TEST
OUT
Reserved for Factory Use.
4*
ML
IN
Latch Enable for Serial Control Data.
5*
MC
IN
Clock for Serial Control Data.
6*
MD
IN
Data Input for Serial Control.
7*
RSTB
IN
Reset Input. When this pin is low, the digital
filters and modulators are held in reset.
8
ZERO
OUT
Zero Data Flag. This pin is low when the data is
continuously zero for more than 65,535 cycles of
BCKIN.
9VOUTR
OUT
Right Channel Analog Output.
10
AGND
PWR
Analog Ground.
11
VCC
PWR
Analog Power Supply (+5V).
12
VOUTL
OUT
Left Channel Analog Output.
13
CAP
—
Common Pin for Analog Output Amplifiers.
14*
BCKIN
IN
Bit Clock for Clocking in the Audio Data.
15*
DIN
IN
Serial Audio Data Input.
16*
LRCIN
IN
Left/Right Word Clock. Frequency is equal to fs.
17
GND
PWR
Ground.
18
NC
—
No Connection.
19
VDD
PWR
Digital Power Supply (+5V). Recommended con-
nection is to the analog power supply.
20
DGND
PWR
Digital Ground. Recommended connection is to
the digital ground plane.
* These pins include internal pull-up resistors.
PIN CONFIGURATION
TOP VIEW
SSOP
PACKAGE INFORMATION
PACKAGE DRAWING
PRODUCT
PACKAGE
NUMBER(1)
PCM1720
20-Pin SSOP
334-1
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
ABSOLUTE MAXIMUM RATINGS
Power Supply Voltage ....................................................................... +6.5V
+VCC to +VDD Difference ................................................................... ±0.1V
Input Logic Voltage .................................................. –0.3V to (VDD + 0.3V)
Power Dissipation .......................................................................... 300mW
Operating Temperature Range ......................................... –25
°C to +85°C
Storage Temperature ...................................................... –55
°C to +125°C
Lead Temperature (soldering, 5s) .................................................. +260
°C
Thermal Resistance,
θ
JA .............................................................. +70°C/W
NC
SCKI
TEST
ML
MC
MD
RSTB
ZERO
V
OUTR
AGND
DGND
V
DD
NC
GND
LRCIN
DIN
BCKIN
CAP
V
OUTL
V
CC
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
Not Recommended For New Designs



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