LM1085 datasheet(3/22 Pages) TI

3 / 22 page

LM1085

www.ti.com

SNVS038G – JULY 1999 – REVISED MARCH 2013

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Maximum Input to Output Voltage Differential

LM1085-ADJ

29V

LM1085-12

18V

LM1085-3.3

27V

LM1085-5.0

25V

Power Dissipation (3)

Internally Limited

Junction Temperature (TJ)

(4)

150°C

Storage Temperature Range

-65°C to 150°C

Lead Temperature

260°C, to 10 sec

ESD Tolerance (5)

2000V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Power dissipation is kept in a safe range by current limiting circuitry. Refer to Overload Recovery in Application Notes.

(4)

The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal

Considerations in the Application Notes.

(5)

For testing purposes, ESD was applied using human body model, 1.5k

Ω in series with 100pF.

Operating Ratings

(1)

Junction Temperature (TJ)

(2)

−40°C to 125°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal

Considerations in the Application Notes.

Electrical Characteristics

Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the operating junction temperature (TJ)

range of -40°C to +125°C. Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical

values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.

Min

Typ

Max

Symbol

Parameter

Conditions

Units

(1)

(2)

(1)

LM1085-ADJ

Reference Voltage

VREF

IOUT = 10mA, VIN−VOUT = 3V

1.238

1.250

1.262

(3)

10mA

≤IOUT ≤ IFULL LOAD,1.5V ≤ (VIN−VOUT) ≤ 15V

1.225

1.250

1.270

LM1085-3.3

IOUT = 0mA, VIN = 5V

3.270

3.300

3.330

≤ IOUT ≤IFULL LOAD, 4.8V≤ VIN ≤15V

3.235

3.300

3.365

LM1085-5.0

Output Voltage

VOUT

IOUT = 0mA, VIN = 8V

4.950

5.000

5.050

(3)

≤ IOUT ≤ IFULL LOAD, 6.5V ≤ VIN ≤ 20V

4.900

5.000

5.100

LM1085-12

IOUT = 0mA, VIN = 15V

11.880

12.000

12.120

≤ IOUT ≤ IFULL LOAD, 13.5V ≤ VIN ≤ 25V

11.760

12.000

12.240

(1)

All limits are specified by testing or statistical analysis.

(2)

Typical Values represent the most likely parametric norm.

(3)

IFULL LOAD is defined in the current limit curves. The IFULL LOAD Curve defines the current limit as a function of input-to-output voltage.

Note that 30W power dissipation for the LM1085 is only achievable over a limited range of input-to-output voltage.

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