OPA211AI datasheet(19/37 Pages) TI1

19 / 37 page

THERMAL CONSIDERATIONS

DFN LAYOUT GUIDELINES

DFN PACKAGE

OPA211

OPA2211

www.ti.com...................................................................................................................................................... SBOS377G – OCTOBER 2006 – REVISED MAY 2009

most likely will not operate normally. If the supplies

DFN packages are physically small, and have a

are low impedance, then the current through the

smaller routing area, improved thermal performance,

steering diodes can become quite high. The current

and improved electrical parasitics. Additionally, the

level depends on the ability of the input source to

absence

external

leads

eliminates

bent-lead

deliver current, and any resistance in the input path.

issues.

The DFN package can be easily mounted using

standard

printed

circuit

board

(PCB)

assembly

techniques. See Application Note QFN/SON PCB

A primary issue with all semiconductor devices is

Attachment (SLUA271) and Application Report Quad

junction

temperature

(TJ).

The

most

obvious

Flatpack No-Lead Logic Packages (SCBA017), both

consideration is assuring that TJ never exceeds the

available for download at www.ti.com.

absolute maximum rating specified for the device.

However, addressing device thermal dissipation has

The exposed leadframe die pad on the bottom of

benefits beyond protecting the device from damage.

the package must be connected to V–. Soldering

Even modest increases in junction temperature can

the thermal pad improves heat dissipation and

decrease

amp

performance,

and

enables specified device performance.

temperature-related

errors

can

accumulate.

Understanding the power generated by the device

within the specific application and assessing the

thermal effects on the error tolerance lead to a better

The exposed leadframe die pad on the DFN package

understanding

system

performance

and

should be soldered to a thermal pad on the PCB. A

thermal-dissipation needs. For dual-channel products,

mechanical drawing showing an example layout is

the worst-case power resulting from both channels

attached at the end of this data sheet. Refinements to

must be determined. Products with a thermal pad

this layout may be necessary based on assembly

(DFN and PowerPAD devices) provide the best

process requirements. Mechanical drawings located

thermal conduction away from the junction; see the

at the end of this data sheet list the physical

Thermal Resistance from Junction to Pad parameter

dimensions for the package and pad. The five holes

(

JP) in the Electrical Characteristics section. The use

in the landing pattern are optional, and are intended

of packages with a thermal pad improves thermal

for use with thermal vias that connect the leadframe

dissipation.

The

device

achieves

its

optimal

die pad to the heatsink area on the PCB.

performance through careful board and system

Soldering the exposed pad significantly improves

design that considers characteristics such as board

board-level reliability during temperature cycling, key

thickness, metal layers, component spacing, airflow,

push, package shear, and similar board-level tests.

and board orientation. Refer to these application

Even

with

applications

that

have

low-power

notes (available for download at www.ti.com) for

dissipation, the exposed pad must be soldered to the

additional

details:

SZZA017A,

SCBA017,

and

PCB to provide structural integrity and long-term

SPRA953A. For unusual loads and signals, see

reliability.

SBOA022.

The OPA211 is offered in an DFN-8 package (also

known as SON). The DFN package is a QFN

package with lead contacts on only two sides of the

bottom of the package. This leadless package

maximizes board space and enhances thermal and

electrical characteristics through an exposed pad.

Submit Documentation Feedback

Product Folder Link(s): OPA211 OPA2211

OPA211AI Datasheet(PDF) 19 Page - Texas Instruments

OPA211AI Datasheet(HTML) 19 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37

Datasheet Download

Link URL