OPA211AI datasheet(20/37 Pages) TI1

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GENERAL POWERPAD DESIGN

OPA211

OPA2211

SBOS377G – OCTOBER 2006 – REVISED MAY 2009...................................................................................................................................................... www.ti.com

example thermal land pattern mechanical drawing

CONSIDERATIONS

is attached to the end of this data sheet.

3. Additional vias may be placed anywhere along

The OPA2211 is available in a thermally-enhanced

the thermal plane outside of the thermal pad area

SO-8

PowerPAD

package.

This

package

to help dissipate the heat generated by the

constructed using a downset leadframe upon which

OPA2211 SO-8. These additional vias may be

the die is mounted, as Figure 50(a) and Figure 50(b)

larger than the 13-mil diameter vias directly under

illustrate. This arrangement results in the lead frame

the thermal pad. They can be larger because

being exposed as a thermal pad on the underside of

they are not in the thermal pad area to be

the package, as shown in Figure 50(c). This thermal

soldered; thus, wicking is not a problem.

pad has direct thermal contact with the die; thus,

excellent

thermal

performance

achieved

4. Connect all holes to the internal plane that is at

providing a good thermal path away from the thermal

the same voltage potential as the V– pin.

pad.

5. When connecting these holes to the internal

plane, do not use the typical web or spoke via

The PowerPAD package allows for both assembly

connection methodology. Web connections have

and thermal management in one manufacturing

a high thermal resistance connection that is

operation. During the surface-mount solder operation

useful for slowing the heat transfer during

(when the leads are being soldered), the thermal pad

soldering operations. This configuration makes

must be soldered to a copper area underneath the

the soldering of vias that have plane connections

package. Through the use of thermal paths within this

easier. In this application, however, low thermal

copper area, heat can be conducted away from the

resistance is desired for the most efficient heat

package

into

either

ground

plane

other

transfer. Therefore, the holes under the OPA2211

heat-dissipating device. Soldering the PowerPAD to

PowerPAD

package

should

make

their

the printed circuit board (PCB) is always required,

connection to the internal plane with a complete

even

with

applications

that

have

low

power

connection around the entire circumference of the

dissipation. This technique provides the necessary

plated-through hole.

thermal and mechanical connection between the lead

frame die pad and the PCB.

6. The top-side solder mask should leave the

terminals of the package and the thermal pad

The PowerPAD must be connected to the most

area with its six holes exposed. The bottom-side

negative supply voltage on the device (V–).

solder mask should cover the holes of the

1. Prepare the PCB with a top-side etch pattern.

thermal pad area. This masking prevents solder

There should be etching for the leads as well as

from being pulled away from the thermal pad

etch for the thermal pad.

area during the reflow process.

2. Place recommended holes in the area of the

7. Apply solder paste to the exposed thermal pad

thermal pad. Ideal thermal land size and thermal

area and all of the IC terminals.

via patterns for the SO-8 DDA package can be

8. With these preparatory steps in place, simply

seen

the

technical

brief,

PowerPAD

place the OPA2211 SO-8 IC in position and run

Thermally-Enhanced

Package

(SLMA002),

the chip through the solder reflow operation as

available for download at www.ti.com. These

any standard surface-mount component. This

holes should be 13 mils (0,33mm) in diameter.

preparation results in a properly installed part.

Keep them small, so that solder wicking through

the holes is not a problem during reflow. An

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