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LSM9DS0TR Datasheet(PDF) 29 Page - STMicroelectronics |
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LSM9DS0TR Datasheet(HTML) 29 Page - STMicroelectronics |
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29 / 74 page ![]() DocID024763 Rev 2 29/74 LSM9DS0 Application hints 74 5 Application hints Figure 11. LSM9DS0 electrical connections 5.1 External capacitors The C1 and C2 external capacitors should be low SR value, ceramic type construction (typ recommended value 200 mOhm). Reservoir capacitor C1 is nominally 4.7 μF in capacitance, with the set/reset capacitor C2 nominally 0.22 μF in capacitance. The device core is supplied through the Vdd line. Power supply decoupling capacitors (C4 = 100 nF ceramic, C3 = 10 μF Al) should be placed as near as possible to the supply pin of the device (common design practice). All the voltage and ground supplies must be present at the same time to have proper behavior of the IC (refer to Figure 11). The functions of the device and the measured acceleration/magnetic field data are selectable and accessible through the I2C / SPI interfaces. The functions, the threshold and the timing of the three interrupt pins (INT_G, INT1_XM and INT2_XM) can be completely programmed by the user through the I2C / SPI interfaces. Pin 1 indicator Res TOP VIEW 18 13 12 7 1 6 24 19 INT1_XM Vdd INT2_XM Vdd_IO C1= 4.7µF C2=0.22µF GND C3= 10µF GND GND C4= 100nF |
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