13

TIME

tp

t 25°C TO PEAK

ts

PREHEAT

CRITICAL ZONE

RAMP UP

RAMP DOWN

25

Figure 19. Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5°C

Table 7. Typical SMT Reflow Profile for Maximum Temperature = 260 +0/ -5°C

Profile Feature

Sn-Pb Solder

Pb-Free Solder

Average ramp-up rate (TL to TP)

3°C/sec max

3°C /sec max

Preheat

– Temperature Min (Tsmin)

– Temperature Max (Tsmax)

– Time (min to max) (ts)

100°C

150°C

60-120 sec

150°C

200°C

60-180 sec

Tsmax to TL

– Ramp-up Rate

3°C/sec max

Time maintained above:

– Temperature (TL)

– Time (TL)

183°C

60-150 sec

217°C

60-150 sec

Peak temperature (Tp)

240 +0/-5°C

260 +0/-5°C

Time within 5°C of actual Peak Temperature (tp)

10-30 sec

20-40 sec

Ramp-down Rate

6°C/sec max

6°C/sec max

Time 25°C to Peak Temperature

6 min max.

8 min max.