AD5313 datasheet(24/28 Pages) AD

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AD5303/AD5313/AD5323

Rev. B | Page 24 of 28

SCLK

DIN

DB15

DB0

DB15

DB0

DB15

DB0

SDO

INPUT WORD FOR DAC N

INPUT WORD FOR DAC (N+1)

UNDEFINED

INPUT WORD FOR DAC N

SCLK

SDO

t14

t15

t13

t12

VIL

VIH

SYNC

Figure 47. Daisy-Chaining Timing Diagram

POWER SUPPLY BYPASSING AND GROUNDING

In any circuit where accuracy is important, careful considera-

tion of the power supply and ground return layout helps to

ensure the rated performance. The printed circuit board on

which the AD5303/AD5313/AD5323 are mounted should be

designed so that the analog and digital sections are separated

and confined to certain areas of the board. If the AD5303/

AD5313/AD5323 are in a system where multiple devices

require an AGND-to-DGND connection, the connection

should be made at one point only. The star ground point

should be established as close as possible to the AD5303/

AD5313/AD5323. The AD5303/AD5313/AD5323 should

have ample supply bypassing of 10 μF in parallel with 0.1 μF

on the supply located as close to the package as possible, ideally

right up against the device. Use 10 μF capacitors that are of the

tantalum bead type. The 0.1 μF capacitor should have low

effective series resistance (ESR) and effective series inductance

(ESI), like the common ceramic types that provide a low

impedance path to ground at high frequencies to handle

transient currents due to internal logic switching.

The power supply lines of the AD5303/AD5313/AD5323 should

use as large a trace as possible to provide low impedance paths

and reduce the effects of glitches on the power supply line. Fast

switching signals such as clocks should be shielded with digital

ground to avoid radiating noise to other parts of the board, and

should never be run near the reference inputs. Avoid crossover

of digital and analog signals. Traces on opposite sides of the

board should run at right angles to each other. This reduces

the effects of feedthrough through the board. A microstrip

technique is by far the best, but is not always possible with a

double-sided board. In this technique, the component side of

the board is dedicated to the ground plane while signal traces

are placed on the solder side.

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