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DM163006 Datasheet(PDF) 300 Page - Microchip Technology

Part # DM163006
Description  High-Performance ROM-less Microcontrollers
PDF  320 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

DM163006 Datasheet(HTML) 300 Page - Microchip Technology

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PIC18C601/801
DS39541A-page 300
Advance Information
 2001 Microchip Technology Inc.
68-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
10
5
0
10
5
0
β
Mold Draft Angle Bottom
10
5
0
10
5
0
α
Mold Draft Angle Top
0.53
0.51
0.33
.021
.020
.013
B
Lower Lead Width
0.81
0.74
0.66
.032
.029
.026
B1
Upper Lead Width
0.33
0.27
0.20
.013
.011
.008
c
Lead Thickness
17
17
n1
Pins per Side
23.62
23.37
22.61
.930
.920
.890
D2
Footprint Length
23.62
23.37
22.61
.930
.920
.890
E2
Footprint Width
24.33
24.23
24.13
.958
.954
.950
D1
Molded Package Length
24.33
24.23
24.13
.958
.954
.950
E1
Molded Package Width
25.27
25.15
25.02
.995
.990
.985
D
Overall Length
25.27
25.15
25.02
.995
.990
.985
E
Overall Width
0.25
0.13
0.00
.010
.005
.000
CH2
Corner Chamfer (others)
1.27
1.14
1.02
.050
.045
.040
CH1
Corner Chamfer 1
0.86
0.74
0.61
.034
.029
.024
A3
Side 1 Chamfer Height
0.51
.020
A1
Standoff
§
A2
Molded Package Thickness
4.57
4.39
4.19
.180
.173
.165
A
Overall Height
1.27
.050
p
Pitch
68
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
β
A2
c
E2
2
D
D1
n
#leads=n1
E
E1
1
α
p
B
A3
A
B1
32
°
D2
68
A1
.145
.153
.160
3.68
3.87
4.06
.028
.035
0.71
0.89
CH1 x 45
°
CH2 x 45
°
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-049
§ Significant Characteristic



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