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DM163006 Datasheet(PDF) 301 Page - Microchip Technology

Part # DM163006
Description  High-Performance ROM-less Microcontrollers
PDF  320 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

DM163006 Datasheet(HTML) 301 Page - Microchip Technology

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 2001 Microchip Technology Inc.
Advance Information
DS39541A-page 301
PIC18C601/801
80-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-092
1.10
1.00
.043
.039
1.14
0.89
0.64
.045
.035
.025
CH
Pin 1 Corner Chamfer
1.00
.039
(F)
Footprint (Reference)
(F)
E
E1
#leads=n1
p
B
D1
D
n
1
2
φ
c
β
L
A
A1
A2
α
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
80
80
Pitch
p
.020
0.50
Overall Height
A
.047
1.20
Molded Package Thickness
A2
.037
.039
.041
0.95
1.00
1.05
Standoff
§
A1
.002
.004
.006
0.05
0.10
0.15
Foot Length
L
.018
.024
.030
0.45
0.60
0.75
Foot Angle
φ
03.5
7
0
3.5
7
Overall Width
E
.541
.551
.561
13.75
14.00
14.25
Overall Length
D
.541
.551
.561
13.75
14.00
14.25
Molded Package Width
E1
.463
.472
.482
11.75
12.00
12.25
Molded Package Length
D1
.463
.472
.482
11.75
12.00
12.25
Pins per Side
n1
20
20
Lead Thickness
c
.004
.006
.008
0.09
0.15
0.20
Lead Width
B
.007
.009
.011
0.17
0.22
0.27
Mold Draft Angle Top
α
5
10
15
5
10
15
Mold Draft Angle Bottom
β
5
10
15
5
10
15
CH x 45
°
§ Significant Characteristic



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