Copyright

© ANPEC Electronics Corp.

Rev. A.1 - Apr., 2012

APL3218

www.anpec.com.tw

2

Ordering and Marking Information

Symbol

Parameter

Rating

Unit

ACIN Input Voltage (ACIN to GND)

-0.3 ~ 20

V

CHR_LDO to GND Voltage

-0.3 ~ 7

V

GATDRV to GND Voltage

V

VCDT to GND Voltage

-0.3 ~ 7

V

OUT to GND Voltage

-0.3 ~ 7

V

Output Current (OUT to GND)

1.5

A

Maximum Junction Temperature

150

Storage Temperature

-65 ~ 150

Maximum Lead Soldering Temperature (10 Seconds)

260

Symbol

Parameter

Typical Value

Unit

θ

JA

TDFN2x2-8 Junction-to-Ambient Resistance in free air

(Note 2)

75

θ

JA

DFN3x3-8 Junction-to-Ambient Resistance in free air

(Note 2)

65

Thermal Characteristic

Note 2:

θ

pad of TDFN2x2-8 is soldered directly on the PCB.

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

Note 1:Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under ”recom-

mended operating conditions”is not implied. Exposure to absolute maximum rating conditions for extended periods may affect vice

reliability.

APL3218

Package Code

Operating Ambient Temperature Range

I : -40 to 85

Handling Code

TR : Tape & Reel

Assembly Material

Handling Code

Temperature Range

Package Code

X - Date Code

G : Halogen and Lead Free Device

Assembly Material

QB : TDFN2x2-8

APL3218 QB:

L18

X

QA : DFN3x3-8

X - Date Code

APL3218 QA:

APL

3218

XXXXX