MP2676 datasheet(2/10 Pages) MPS

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MP2676 –LI-ION CHARGER PROTECTION IC WITH INTEGRATED P-MOSFET

MP2676 Rev. 0.91

www.MonolithicPower.com

12/7/2010

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

Free Air Temperature (TA)

MP2676EG

QFN8 (2mm x 2mm)

-20

°C to +85°C

* For Tape & Reel, add suffix –Z (e.g. MP2676EG–Z)

For RoHS compliant packaging, add suffix –LF (e.g. MP2676EG–LF–Z)

PACKAGE REFERENCE

TOP VIEW

ACIN

GND

VBAT

OUT

CHRIN

GATDRV

ABSOLUTE MAXIMUM RATINGS (1)

ACIN to GND...................................-0.3V to 30V

OUT, GATDRV and CHRIN to GND

..........................................................-0.3V to 7V

VBAT .............................................-0.3V to 5.5V

Continuous Power Dissipation

(TA = +25°C)

(2)

QFN8 (2mm x 2mm) ................................ 1.25W

Junction Temperature...............................150

°C

Storage Temperature............... -65

°C to +150°C

Lead Temperature ...................................260°C

Recommended Operating Conditions (3)

Supply Voltage VIN ..........................4.3V to 5.5V

Operating Junct. Temp (TJ)...... -20°C to +125°C

Thermal Resistance

(4)

θJA

θJC

QFN8 (2mm x 2mm).............. 100 ......55...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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