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LXT9785 Datasheet(PDF) 5 Page - List of Unclassifed Manufacturers

Part # LXT9785
Description  Advanced 8-Port 10/100 Mbps PHY Transceivers
PDF  244 Pages
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Manufacturer  ETC2 [List of Unclassifed Manufacturers]
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LXT9785 Datasheet(HTML) 5 Page - List of Unclassifed Manufacturers

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Page 5
Cortina Systems® LXT9785 and LXT9785E Advanced 8-Port 10/100 Mbps PHY Transceivers
LXT9785/LXT9785E
Datasheet
249241, Revision 12.0
04 November 2011
Contents
4.9.3.2
Link Failure Override............................................................................ 169
4.9.3.3
Carrier Sense/Data Valid (RMII) .......................................................... 169
4.9.3.4
Carrier Sense (SMII) ............................................................................ 169
4.9.3.5
Receive Data Valid (SMII).................................................................... 169
4.9.3.6
Twisted-Pair PMD Sublayer................................................................. 169
4.9.3.7
Fiber PMD Sublayer............................................................................. 170
4.10 10 Mbps Operation ...........................................................................................................171
4.10.1 Preamble Handling .............................................................................................. 171
4.10.2 Dribble Bits .......................................................................................................... 171
4.10.3 Link Test .............................................................................................................. 171
4.10.3.1 Link Failure .......................................................................................... 172
4.10.4 Jabber.................................................................................................................. 172
4.11 DTE Discovery Process.................................................................................................... 172
4.11.1 Definitions ............................................................................................................ 172
4.11.2 Interaction between Processor, MAC, and PHY.................................................. 173
4.11.3 Management Interface and Control ..................................................................... 174
4.11.4 DTE Discovery Process Flow .............................................................................. 175
4.11.5 DTE Discovery Behavior...................................................................................... 176
4.12 Monitoring Operations ...................................................................................................... 177
4.12.1 Monitoring Auto-Negotiation ................................................................................ 177
4.12.2 Per-Port LED Driver Functions ............................................................................ 178
4.12.3 Out-of-Band Signaling ......................................................................................... 179
4.12.4 Boundary Scan Interface ..................................................................................... 180
4.12.5 State Machine...................................................................................................... 180
4.12.6 Instruction Register.............................................................................................. 180
4.12.7 Boundary Scan Register...................................................................................... 180
4.13 Cable Diagnostics Overview............................................................................................. 181
4.13.1 Features............................................................................................................... 181
4.13.2 Operation ............................................................................................................. 181
4.13.2.1 Short and Long Cable Testing Requirements...................................... 181
4.13.2.2 Precision .............................................................................................. 181
4.13.3 Implementation Considerations ........................................................................... 182
4.13.4 Basic Implementation .......................................................................................... 182
4.14 Link Hold-Off Overview..................................................................................................... 183
4.14.1 Features............................................................................................................... 183
4.14.2 Operation ............................................................................................................. 184
5.0
Application Information ............................................................................................................ 185
5.1
Design Recommendations................................................................................................ 185
5.2
General Design Guidelines............................................................................................... 185
5.2.1
Power Supply Filtering......................................................................................... 185
5.2.2
Power and Ground Plane Layout Considerations................................................ 186
5.2.2.1
Chassis Ground ................................................................................... 186
5.2.3
MII Terminations .................................................................................................. 186
5.2.4
Twisted-Pair Interface.......................................................................................... 186
5.2.4.1
Magnetic Requirements ....................................................................... 187
5.2.5
The Fiber Interface .............................................................................................. 187
5.2.6
LED Circuit........................................................................................................... 188
5.3
Typical Application Circuits............................................................................................... 188
6.0
Test Specifications.................................................................................................................... 194
7.0
Register Definitions................................................................................................................... 214



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