www.austriamicrosystems.com/AS3931

Revision 6.2

5 - 30

AS3931

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only. Functional operation of the

device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 6 is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Notes

Positive supply voltage

-0.5

5.5

V

Analog ground

(GND)

00

V

V

Voltage at Pin 2 to Pin 7

GND-0.5

GND+0.5

V

Input current (Latchup Immunity)

-100

+100

mA

JEDEC 78

Electrostatic discharge

1000

V

Norm: MIL 883 E method 3015

HBM: R=1.5 k

Ω, C=100 pF

Total power dissipation

300

mW

Storage temperature

-55

125

ºC

Package body temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/

JEDEC J-STD-020 “Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid State

Surface Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).

Humidity non-condensing

5

85

%

Moisture Sensitive Level

3

Represents a maximum floor life time of 168h

Operating Ambient Temperature Range

-20

+65

ºC

Recommended Operating Conditions

Positive supply voltage

2.6

5.5

V

Regulator used

Positive supply voltage

2.4

3.5

V

Regulator not used

Analog Ground

(GND)

00

V