Serial Memory Products

5

Memory Package Matrix

Memory Packages – more memory in less space!

Serial EEPROM devices from Microchip are available in a wide variety of tiny, innovative packages to help minimize

your design – save board space and cost!

Density

Max

Speed

SOIC

SN

SOT-23

OT/TT

TSSOP

TS

TDFN

MNY/MC

PDIP

P

MSOP

MS

SOIJ

SM

DFN

MF

SC70

LT

TO92

TO

Wafer

W/S/WF

WLCSP

CS

5x6

3x3

3x6.5

2x3

8x9.5

3x5

5x8

5x6

2x2

Die

Die

128bit-2K

400 KHz

X

5

XX

X

X

5

X

4K-32K

400 KHz

X

5

XX

X

X

X

X

64K

1 MHz

X

5

XX

X

X

X

X

X

128K

1 MHz

XX

X

X

X

X

X

X

X

256K

1 MHz

XX

X

X

X

X

X

X

512K

1 MHz

XX

X

X

X

X

X

1 Mbit

1 MHz

XX

X

Microwire Bus 1.8V-5.5V

1K-16K

3 MHz

X

6

XX

X

X

X

SPI Bus 1.8V-5.5V

1K-4K

10 MHz

X

6

XX

X

X

X

8K-64K

10 MHz

XX

X

X

X

X

128K, 256K

10 MHz

XX

X

X

X

X

512K

20 MHz

X

14

XX

X

X

1 Mbit

20 MHz

XX

X

X

1K-16K

100 KHz

X

3

XX

X

X

X

X

Package Sizes

8-SOIC (SN)

5 x 6 mm

8-DFN (MF)

5 x 6 mm

8-SOIC (SM)

5 x 8 mm

8-PDIP (P)

8 x 9.5 mm

Die/Wafer

WL-CSP

.

5-SC70

(LT)

2 x 2 mm

.

3-SOT

(TT)

3 x 2.5 mm

.

.

5 & 6-SOT

(OT)

3 x 3 mm

.

8-TDFN

(MC/MNY)

2 x 3 mm

.

8-MSOP

(MS)

3 x 5 mm

.

8-TSSOP

(ST)

3 x 6.5 mm

WLCSP – World’s Smallest EEPROM Package

WLCSP from Microchip is bumped die with a redistribution layer to route

the bond pads to the bumps.

networking, RF, medical, portable electronics

<1 x 1 mm

Actual Size

Enlarged to Show

Detail

Wafer Level

Chip Scale Packaging