| Electronic Components Datasheet Search |
|
CS51312 Datasheet(PDF) 16 Page - Cherry Semiconductor Corporation |
|
|
|||||||||||||||||||||||||||||
CS51312 Datasheet(HTML) 16 Page - Cherry Semiconductor Corporation |
|
16 / 18 page ![]() Application Information: continued 16 and output capacitors and load. This resistor carries the full load current and should be chosen so that both DC and AC tolerance limits are met. In order to determine the droop resistor value the nominal voltage drop across it at full load has to be calculated. This voltage drop has to be such that the output voltage at full load is above the minimum DC tolerance spec: VDROOP(TYP) = . Current Limit The current limit setpoint has to be higher than the normal full load current. Attention has to be paid to the current rating of the external power components as these are the first to fail during an overload condition. The MOSFET continuous and pulsed drain current rating at a given case temperature has to be accounted for when setting the cur- rent limit trip point. Nominal Current Limit Setpoint From the overcurrent detection data in the electrical char- acteristics table: VTH(TYP) = 86mV, ICL(NOM) = Design Rules for Using a Droop Resistor The basic equation for laying an embedded resistor is: RAR = ρ × or R = ρ × , where A= W × t = cross-sectional area; ρ= the copper resistivity (µΩ-mil); L= length (mils); W = width (mils); t = thickness (mils). An embedded PC trace resistor has the distinct advantage of near zero cost implementation. However, this droop resistor can vary due to three reasons: 1) the sheet resistivi- ty variation caused by variation in the thickness of the PCB layer; 2) the mismatch of L/W; and 3) temperature varia- tion. 1) Sheet Resistivity For one ounce copper, the thickness variation is typically 1.26 mil to 1.48 mil. Therefore the error due to sheet resis- tivity is: = ±8%. 2) Mismatch due to L/W The variation in L/W is governed by variations due to the PCB manufacturing process. The error due to L/W mis- match is typically 1%. 3) Thermal Considerations Due to I2 × R power losses the surface temperature of the droop resistor will increase causing the resistance to increase. Also, the ambient temperature variation will con- tribute to the increase of the resistance, according to the formula: R = R20 [1+ α20(Τ−20)], where R20 = resistance at 20˚C; α =; T= operating temperature; R = desired droop resistor value. For temperature T = 50˚C, the % R change = 12%. Droop Resistor Tolerance Tolerance due to sheet resistivity variation ±8% Tolerance due to L/W error 1% Tolerance due to temperature variation 12% Total tolerance for droop resistor 21% Droop Resistor Length, Width, and Thickness The minimum width and thickness of the droop resistor should primarily be determined on the basis of the current- carrying capacity required, and the maximum permissible droop resistor temperature rise. PCB manufacturer design charts can be used in determining current- carrying capaci- ty and sizes of etched copper conductors for various tem- perature rises above ambient. Thermal Management Thermal Considerations for Power MOSFET In order to maintain good reliability, the junction tempera- ture of the semiconductor components should be kept to a maximum of 150°C or lower. The thermal impedance (junction to ambient) required to meet this requirement can be calculated as follows: Thermal Impedance = A heatsink may be added to TO-220 components to reduce their thermal impedance. A number of PC board layout techniques such as thermal vias and additional copper foil area can be used to improve the power handling capability of surface mount components. EMI Management As a consequence of large currents being turned on and off at high frequency, switching regulators generate noise as a consequence of their normal operation. When designing for compliance with EMI/EMC regulations, additional components may be added to reduce noise emissions. These components are not required for regulator operation and experimental results may allow them to be eliminated. The input filter inductor may not be required because bulk TJ(MAX) - TA Power 0.00393 ˚C 1.48 - 1.26 1.37 L (W × t) L A VTH(TYP) RSENSE(NOM) VDAC(MIN)-VDC(MIN) 1+RDROOP(TOLERANCE) |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |