LM5113 datasheet(5/24 Pages) TI1

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LM5113

www.ti.com

SNVS725E – JUNE 2011 – REVISED JANUARY 2012

Electrical Characteristics

Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C

to +125°C. Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values

represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise

specified, VDD = VHB = 5V, VSS = VHS = 0V, No Load on LOL and HOL or HOH and HOL

(1).

Symbol

Parameter

Conditions

Min

Typ

Max

Units

SUPPLY CURRENTS

IDD

VDD Quiescent Current

LI = HI = 0V

0.07

0.1

IDDO

VDD Operating Current

f = 500 kHz

2.0

3.0

IHB

Total HB Quiescent Current

LI = HI = 0V

0.08

0.1

IHBO

Total HB Operating Current

f = 500 kHz

1.5

2.5

IHBS

HB to VSS Current, Quiescent

HS = HB = 100V

0.1

µA

IHBSO

HB to VSS Current, Operating

f = 500 kHz

0.4

1.0

INPUT PINS

VIR

Input Voltage Threshold

Rising Edge

1.89

2.06

2.18

VIF

Input Voltage Threshold

Falling Edge

1.48

1.66

1.76

VIHYS

Input Voltage Hysteresis

400

Input Pulldown Resistance

100

200

300

Ω

UNDER VOLTAGE PROTECTION

VDDR

VDD Rising Threshold

3.2

3.8

4.5

VDDH

VDD Threshold Hysteresis

0.2

VHBR

HB Rising Threshold

2.5

3.2

3.9

VHBH

HB Threshold Hysteresis

0.2

BOOTSTRAP DIODE

VDL

Low-Current Forward Voltage

IVDD-HB = 100 µA

0.45

0.65

VDH

High-Current Forward Voltage

IVDD-HB = 100 mA

0.90

1.00

Dynamic Resistance

IVDD-HB = 100 mA

1.85

3.60

Ω

HB-HS Clamp

Regulation Voltage

4.7

5.2

5.45

LOW & HIGH SIDE GATE DRIVER

VOL

Low-Level Output Voltage

IHOL = ILOL = 100 mA

0.06

0.10

VOH

High-Level Output Voltage

IHOH = ILOH = 100 mA

0.21

0.31

VOH = VDD – LOH or VOH = HB – HOH

IOHL

Peak Source Current

HOH, LOH = 0V

1.2

IOLL

Peak Sink Current

HOL, LOL = 5V

IOHLK

High-Level Output Leakage Current

HOH, LOH = 0V

1.5

µA

IOLLK

Low-Level Output Leakage Current

HOL, LOL = 5V

1.5

µA

THERMAL RESISTANCE

θJA

Junction to Ambient (2)

LLP-10

°C/W

12-bump micro SMD

°C/W

(1)

Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlation

using Statistical Quality Control (SQC) methods. Limits are used to calculate National’s Average Outgoing Quality Level (AOQL).

(2)

Four layer board with Cu finished thickness 1.5/1/1/1.5 oz. Maximum die size used. 5x body length of Cu trace on PCB top. 50 x 50mm

ground and power planes embedded in PCB. See Application Note AN-1187.

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