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LM5113 Datasheet(PDF) 1 Page - Texas Instruments |
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LM5113 Datasheet(HTML) 1 Page - Texas Instruments |
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1 / 24 page ![]() LM5113 www.ti.com SNVS725E – JUNE 2011 – REVISED JANUARY 2012 LM5113 5A, 100V Half-Bridge Gate Driver for Enhancement Mode GaN FETs Check for Samples: LM5113 1 FEATURES • Excellent propagation delay matching (1.5ns typical) 2 • Independent high-side and low-side TTL logic • Supply rail under-voltage lockout inputs • Low power consumption • 1.2A/5A peak source/sink current • High-side floating bias voltage rail operates up TYPICAL APPLICATIONS to 100VDC • Current Fed Push-Pull converters • Internal bootstrap supply voltage clamping • Half and Full-Bridge converters • Split outputs for adjustable turn-on/turn-off strength • Synchronous Buck converters • 0.6 Ω /2.1Ω pull-down/pull-up resistance • Two-switch Forward converters • Fast propagation times (28ns typical) • Forward with Active Clamp converters DESCRIPTION The LM5113 is designed to drive both the high-side and the low-side enhancement mode Gallium Nitride (GaN) FETs in a synchronous buck or a half bridge configuration. The floating high-side driver is capable of driving a high-side enhancement mode GaN FET operating up to 100V. The high-side bias voltage is generated using a bootstrap technique and is internally clamped at 5.2V, which prevents the gate voltage from exceeding the maximum gate-source voltage rating of enhancement mode GaN FETs. The inputs of the LM5113 are TTL logic compatible, and can withstand input voltages up to 14V regardless of the VDD voltage. The LM5113 has split gate outputs, providing flexibility to adjust the turn-on and turn-off strength independently. In addition, the strong sink capability of the LM5113 maintains the gate in the low state, preventing unintended turn-on during switching. The LM5113 can operate up to several MHz. The LM5113 is available in a standard LLP-10 pin package and a 12-bump micro SMD package. The LLP-10 pin package contains an exposed pad to aid power dissipation. The micro SMD package offers a compact footprint and minimized package inductance. Packages • LLP-10 (4 mm x 4 mm) • micro SMD (2 mm x 2 mm) 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Copyright © 2011–2012, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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