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LM5113 Datasheet(PDF) 12 Page - Texas Instruments |
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LM5113 Datasheet(HTML) 12 Page - Texas Instruments |
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12 / 24 page ![]() LM5113 SNVS725E – JUNE 2011 – REVISED JANUARY 2012 www.ti.com The LM5113 has an Under-voltage Lockout (UVLO) on both the VDD and bootstrap supplies. When the VDD voltage is below the threshold voltage of 3.8V, both the HI and LI inputs are ignored, to prevent the GaN FETs from being partially turned on. Also if there is sufficient VDD voltage, the UVLO will actively pull the LOL and HOL low. When the HB to HS bootstrap voltage is below the UVLO threshold of 3.2V, only HOL is pulled low. Both UVLO threshold voltages have 200mV of hysteresis to avoid chattering. Bypass Capacitor The VDD bypass capacitor provides the gate charge for the low-side and high-side transistors and to absorb the reverse recovery charge of the bootstrap diode. The required bypass capacitance can be calculated as follows: (1) QgH and QgL are gate charge of the high-side and low-side transistors respectively. Qrr is the reverse recovery charge of the bootstrap diode, which is typically around 4nC. ΔV is the maximum allowable voltage drop across the bypass capacitor. A 0.1uF or larger value, good quality, ceramic capacitor is recommended. The bypass capacitor should be placed as close to the pins of the IC as possible to minimize the parasitic inductance. Bootstrap Capacitor The bootstrap capacitor provides the gate charge for the high-side switch, dc bias power for HB under-voltage lockout circuit, and the reverse recovery charge of the bootstrap diode. The required bypass capacitance can be calculated as follows: (2) IHB is the quiescent current of the high-side driver. ton is the maximum on-time period of the high-side transistor. A good quality, ceramic capacitor should be used for the bootstrap capacitor. It is recommended to place the bootstrap capacitor as close to the HB and HS pins as possible. Power Dissipation The power consumption of the driver is an important measure that determines the maximum achievable operating frequency of the driver. It should be kept below the maximum power dissipation limit of the package at the operating temperature. The total power dissipation of the LM5113 is the sum of the gate driver losses and the bootstrap diode power loss. The gate driver losses are incurred by charge and discharge of the capacitive load. It can be approximated as (3) CLoadH and CLoadL are the high-side and the low-side capacitive loads respectively. It can also be calculated with the total input gate charge of the high-side and the low-side transistors as 12 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM5113 |
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