LP38859 datasheet(2/21 Pages) TI1

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TAB

GND

BIAS

OUT

GND

TAB

GND

BIAS

OUT

GND

LP38859

SNVS337D – JUNE 2006 – REVISED OCTOBER 2011

www.ti.com

Connection Diagram

Figure 1. 5-Lead DDPAK/TO-263, Top View

Figure 2. 5-Lead TO-220, Top View

See KTT Package

See NDH005D Package

PIN DESCRIPTIONS

TO-220 and DDPAK/TO-263 Packages

Pin #

Pin Symbol

Pin Description

Soft-Start capacitor connection. Used to slow the rise time of VOUT at turn-on.

The unregulated voltage input pin.

GND

Ground

OUT

The regulated output voltage pin.

BIAS

The supply for the internal control and reference circuitry.

The TAB is a thermal connection that is physically attached to the backside of the

TAB

die, and used as a thermal heat-sink connection. See the Application Information

section for details.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Storage Temperature Range

−65°C to +150°C

Lead Temperature Soldering, 5 seconds

260°C

ESD Rating

Human Body Model(3)

±2 kV

Power Dissipation(4)

Internally Limited

VIN Supply Voltage (Survival)

−0.3V to +6.0V

VBIAS Supply Voltage (Survival)

−0.3V to +6.0V

VSS SoftStart Voltage (Survival)

−0.3V to +6.0V

VOUT Voltage (Survival)

−0.3V to +6.0V

IOUT Current (Survival)

Internally Limited

Junction Temperature

−40°C to +150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and conditions,

see the Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

The human body model is a 100 pF capacitor discharged through a 1.5k resistor into each pin. Test method is per JESD22-A114. The

HBM rating for device pin 1 (SS) is ±1.5 kV.

(4)

Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to

ambient thermal resistance (

θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not

exceed the maximum operating rating. See the Application Information section for details.

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