LP38859 datasheet(4/21 Pages) TI1

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LP38859

SNVS337D – JUNE 2006 – REVISED OCTOBER 2011

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Electrical Characteristics (continued)

Unless otherwise specified: VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, IOUT = 10 mA, CIN = COUT = 10 µF, CBIAS = 1 µF, CSS = open.

Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C

to +125°C. Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent

the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.

Symbol

Parameter

Conditions

MIN

TYP

MAX

Units

AC Parameters

VIN = VOUT(NOM) + 1V,

f = 120 Hz

PSRR

Ripple Rejection for VIN Input

(VIN)

Voltage

VIN = VOUT(NOM) + 1V,

f = 1 kHz

VBIAS = VOUT(NOM) + 3V,

f = 120 Hz

PSRR

Ripple Rejection for VBIAS Voltage

(VBIAS)

VBIAS = VOUT(NOM) + 3V,

f = 1 kHz

Output Noise Density

f = 120 Hz

µV/

√Hz

BW = 10 Hz

− 100 kHz

150

Output Noise Voltage

µV (rms)

VOUT = 1.8V

BW = 300 Hz

− 300 kHz

Thermal Parameters

Thermal Shutdown Junction

TSD

160

Temperature

°C

TSD(HYS)

Thermal Shutdown Hysteresis

TO-220

Thermal Resistance, Junction to

θJ-A

Ambient(4)

DDPAK/TO-263

°C/W

TO-220

Thermal Resistance, Junction to

θJ-C

Case(4)

DDPAK/TO-263

(4)

Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to

ambient thermal resistance (

θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not

exceed the maximum operating rating. See the Application Information section for details.

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