LM3677 datasheet(4/30 Pages) TI1

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LM3677

SNVS502E – MARCH 2007 – REVISED OCTOBER 2008

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ABSOLUTE MAXIMUM RATINGS

(1)

If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributor for

availability and specifications.

VIN Pin: Voltage to GND

−0.2V to 6.0V

FB, SW, EN Pin:

(GND

−0.2V) to

(VIN + 0.2V)

Continuous Power Dissipation (2)

Internally Limited

Junction Temperature (TJ-MAX)

+125°C

Storage Temperature Range

−65°C to +150°C

Maximum Lead Temperature

260°C

(Soldering, 10 sec.)

ESD Rating (3)

Human Body Model: All Pins

2.0 kV

Machine Model: All Pins

200V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed

performance limits and associated test conditions, see the Electrical Characteristics tables.

(2)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ= 150°C (typ.) and

disengages at TJ= 130°C (typ.).

(3)

The Human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. The machine model is a 200 pF

capacitor discharged directly into each pin. MIL-STD-883 3015.7

OPERATING RATINGS

(1), (2)

Input Voltage Range

2.7V to 5.5V

Recommended Load Current

0 mA to 600 mA

Junction Temperature (TJ) Range

−30°C to +125°C

Ambient Temperature (TA) Range

(3)

−30°C to +85°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed

performance limits and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

In Applications where high power dissipation and/or poor package resistance is present, the maximum ambient temperature may have

to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX), the

maximum power dissipation of the device in the application (PD-MAX) and the junction to ambient thermal resistance of the package (θJA)

in the application, as given by the following equation: TA-MAX= TJ-MAX− (θJAx PD-MAX). Refer to Dissipation rating table for PD-MAX values

at different ambient temperatures.

THERMAL PROPERTIES

Junction-to-Ambient Thermal Resistance (

θJA)

(1)

85°C/W

(1)

Junction to ambient thermal resistance is highly application and board layout dependent. In applications where high power dissipation

exists, special care must be given to thermal dissipation issues in board design. Value specified here 85 °C/W is based on

measurement results using a 4 layer board as per JEDEC standards.

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