LM7171 datasheet(4/33 Pages) TI1

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LM7171

SNOS760C – MAY 1999 – REVISED SEPTEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply Voltage (V+–V−)

Differential Input Voltage (2)

±10

Output Short Circuit to Ground (3)

Continuous

Maximum Junction Temperature (4)

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input differential voltage is applied at VS = ±15V.

(3)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C.

(4)

The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX)–TA)/RθJA. All numbers apply for packages soldered directly into a PC board.

6.2 Handling Ratings

MIN

MAX

UNIT

Tstg

Storage temperature range

−65

+150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

2500

V(ESD)

Electrostatic discharge(1)

pins(2)

(1)

Human body model, 1.5 k

Ω in series with 100 pF.

(2)

JEDEC document JEP155 states that 2500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

TYP

MAX

UNIT

Supply Voltage

5.5V

≤ VS ≤ 36

Operating Temperature Range: LM7171AI, LM7171BI

−40

+85

°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not specified. For ensured specifications and the test

conditions, see the Electrical Characteristics.

6.4 Thermal Information

P (PDIP)

D (SOIC)

THERMAL METRIC(1)

UNIT

8 PINS

RθJA

Junction-to-ambient thermal resistance

108°

172°

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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