TMD2772

DIGITAL ALS

and PROXIMITY MODULE

TAOS147

E − DECEMBER 2012

32

r

r

Copyright

E 2012, TAOS Inc.

The LUMENOLOGY

r Company

www.taosinc.com

STORAGE INFORMATION

Moisture Sensitivity

Optical characteristics of the device can be adversely affected during the soldering process by the release and

vaporization of moisture that has been previously absorbed into the package. To ensure the package contains

the smallest amount of absorbed moisture possible, each device is baked prior to being dry packed for shipping.

Devices are dry packed in a sealed aluminized envelope called a moisture-barrier bag with silica gel to protect

them from ambient moisture during shipping, handling, and storage before use.

Shelf Life

The calculated shelf life of the device in an unopened moisture barrier bag is 12 months from the date code on

the bag when stored under the following conditions:

Shelf Life: 12 months

Ambient Temperature: < 40

°C

Relative Humidity: < 90%

Rebaking of the devices will be required if the devices exceed the 12 month shelf life or the Humidity Indicator

Card shows that the devices were exposed to conditions beyond the allowable moisture region.

Floor Life

The module has been assigned a moisture sensitivity level of MSL 3. As a result, the floor life of devices removed

from the moisture barrier bag is 168 hours from the time the bag was opened, provided that the devices are

stored under the following conditions:

Floor Life: 168 hours

Ambient Temperature: < 30

°C

Relative Humidity: < 60%

If the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior

to solder reflow or dry packing.

Rebaking Instructions

When the shelf life or floor life limits have been exceeded, rebake at 50

°C for 12 hours.