PARANI-BCD210

Page 3 of 25

목차

1. 개요............................................................................................................................................................... 4

1.1 특징 ..................................................................................................................................................... 4

1.2 적용분야 .............................................................................................................................................. 4

1.3 블럭 다이어그램.................................................................................................................................. 5

1.4 핀 배치도............................................................................................................................................. 5

1.5 핀 설명 ................................................................................................................................................ 6

1.6 PCB 치수 ............................................................................................................................................. 8

1.7 권장 랜드 패턴.................................................................................................................................. 10

1.8 권장 보드 배치.................................................................................................................................. 10

2. 전기적 특성 .................................................................................................................................................11

2.1 절대적 한계치 ....................................................................................................................................11

2.2 권장 동작 범위...................................................................................................................................11

2.3 전력 소모............................................................................................................................................11

3. RF 특성 ....................................................................................................................................................... 12

3.1 Basic Data Rate.................................................................................................................................. 12

3.1.1 송신부 성능............................................................................................................................. 12

3.1.2 송신부...................................................................................................................................... 12

3.1.3 수신부 성능............................................................................................................................. 12

3.2 Enhanced Data Rate .......................................................................................................................... 13

3.2.1 송신부 성능............................................................................................................................. 13

3.2.2 수신부 성능............................................................................................................................. 14

4. 장비 입출력 설명 ....................................................................................................................................... 15

4.1 UART 인터페이스 .............................................................................................................................. 15

4.2 USB 인터페이스 ................................................................................................................................ 15

4.3 I2C 인터페이스 .................................................................................................................................. 16

4.4 PCM CODEC 인터페이스.................................................................................................................. 16

4.5 I/O 병렬 포트 (I/O Parallel Ports) ..................................................................................................... 17

4.6 리셋 인터페이스 (Reset Interface)................................................................................................... 17

5. 응용 회로도 (Application Schematic) ........................................................................................................ 18

6. 소프트웨어 스택 ......................................................................................................................................... 21

7. 납땜 프로파일 (Solder Profiles)................................................................................................................. 22

8. 패키징 정보 ................................................................................................................................................ 23

9. 인증정보...................................................................................................................................................... 24

9.1 FCC .................................................................................................................................................... 24

9.2 CE....................................................................................................................................................... 24

9.3 IC ........................................................................................................................................................ 25

9.4 KC....................................................................................................................................................... 25

9.5 TELEC ................................................................................................................................................ 25

9.6 SIG ..................................................................................................................................................... 25