6

PS2625, PS2626, PS2625L, PS2626L

SOLDERING PRECAUTION

(1) Infrared reflow soldering

• Peak reflow temperature

: 235 ˚C or below (Plastic surface temperature)

• Reflow time

: 30 seconds or less

(Time period during which the plastic surface temperature is 210 ˚C)

• Number of reflow processes : Three

• Flux

: Rosin flux containing small amount of chlorine

(The flux with a maximum chlorine content of 0.2 Wt % is recommended.)

INFRARED RAY REFLOW TEMPERATURE PROFILE

Peak Temperature 235 ˚C or Lower

TIME (s)

60 to 90 s

(PRE-HEAT)

120 to 160 ˚C

(ACTUAL HEAT)

to 10 s

235 ˚C MAX.

210 ˚C

to 30 s

(2) Dip soldering

• Peak temperature

:

260 ˚C or lower

• Time

:

10 s or less

• Flux

:

Rosin-base flux