SSM2160/SSM2161

REV. A

–3–

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage

Dual Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±18 V

Single Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+18 V

Analog Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±V

S

Analog Output Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . .

±V

S

Logic Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±V

S

Operating Temperature Range . . . . . . . . . . . . . –40

°C to +85°C

Storage Temperature . . . . . . . . . . . . . . . . . . . –65

°C to +150°C

Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . . +300

°C

THERMAL CHARACTERISTICS

Thermal Resistance

2

24-Pin Plastic DIP (SSM2160)

θ

JA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

°C/W

θ

JC

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

°C/W

24-Pin SOIC (SSM2160)

θ

JA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

°C/W

θ

JC

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

°C/W

20-Pin Plastic DIP (SSM2161)

θ

JA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

°C/W

θ

JC

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

°C/W

20-Pin SOIC (SSM2161)

θ

JA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

°C/W

θ

JC

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

°C/W

ESD RATINGS

883 (Human Body) Model . . . . . . . . . . . . . . . . . . . . . TBD kV

EIAJ Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TBD V

NOTES

nent damage to the device. This is a stress rating only and functional operation of

the device at these or any other conditions above those indicated in the operation

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

2

θ

for P-DIP and device soldered in circuit board for SOIC package.

PIN CONFIGURATIONS

24-Lead Epoxy DIP and SOIC

13

16

15

14

24

23

22

21

20

19

18

17

TOP VIEW

(Not to Scale)

12

11

10

9

8

1

2

3

4

7

6

5

SSM2160

V+

VOUT2

MSTR SET

MSTR OUT

CH SET

AGND

ACOM

VOUT1

VIN4

VOUT4

VIN2

VIN1

VOUT3

VIN3

VOUT5

VIN5

WRITE

DATA

VIN6

VOUT6

LD

V–

CLK

DGND

20-Lead Epoxy DIP and SOIC

14

13

12

11

17

16

15

20

19

18

10

9

8

1

2

3

4

7

6

5

TOP VIEW

(Not to Scale)

SSM2161

V+

VOUT2

MSTR SET

MSTR OUT

CH SET

AGND

ACOM

VOUT1

VIN4

VOUT4

VIN2

VIN1

VOUT3

VIN3

WRITE

LD

V–

DGND

CLK

DATA

WARNING!

ESD SENSITIVE DEVICE

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the SSM2160/SSM2161 features proprietary ESD protection circuitry, permanent

damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper

ESD precautions are recommended to avoid performance degradation or loss of functionality.

ORDERING GUIDE

Model

Temperature Range Package Option

SSM2160P

–40

°C to +85°C

24-Lead Plastic DIP

SSM2160S

–40

°C to +85°C

24-Lead SOL

SSM2160S-REEL –40

°C to +85°C

24-Lead SOL

SSM2161P

–40

°C to +85°C

20-Lead Plastic DIP

SSM2161S

–40

°C to +85°C

20-Lead SOL

SSM2161S-REEL –40

°C to +85°C

20-Lead SOL

OBSOLETE