80960SA datasheet(31/39 Pages) INTEL

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80960SA

3.4

Package Thermal Specifications

The 80960SA is specified for operation when case

temperature is within the range 0°C to +85°C (PLCC)

or 0°C to 100°C (QFP). Measure case temperature

at the top center of the package. Ambient temper-

ature can be calculated from:

TJ = TC + P*θJC

TA = TJ - P*θJA

TC = TA + P*[θJA−θJC]

Compute P by multiplying the maximum voltage by

the typical current at maximum temperature. Values

for

JA and θJC for various airflows are given in Table

13 for the QFP package and in Table 14 for the

PLCC package. ICC at maximum temperature is

typically 80 percent of specified ICC maximum (cold).

Table 13. 80960SA QFP Package Thermal Characteristics

Thermal Resistance — °C/Watt

Parameter

Airflow — ft./min (m/sec)

100

200

400

600

800

θ Junction-to-Ambient (Case

measured in the middle of the

top of the package)

(No Heatsink)

θ Junction-to-Case

NOTES:

This table applies to 80960SA QFP soldered directly to board.

Table 14. 80960SA PLCC Package Thermal Characteristics

Thermal Resistance — °C/Watt

Parameter

Airflow — ft./min (m/sec)

100

200

400

600

800

1000

θ Junction-to-Ambient

(No Heatsink)

29.5

20.5

θ Junction-to-Case

NOTES:

This table applies to 80960SA PLCC soldered directly to board.

3.5

Stepping Register Information

Upon reset, register g0 contains die stepping infor-

mation. Table 15 shows the relationship between the

number in g0 and the current die stepping

The current numbering pattern in g0 may not be

consistent with past or future steppings of this

product.

Table 15. Die Stepping Cross Reference

Die Stepping

01010101H

C-1

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