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HIP5020 Datasheet(PDF) 12 Page - Intersil Corporation |
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HIP5020 Datasheet(HTML) 12 Page - Intersil Corporation |
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12 / 15 page ![]() 2-24 a higher ripple voltage for load current between 0.2A and 0.6A. If the load is sensitive to power supply ripple during this load range, the lower efficiency HMI setting should be used. The voltage on the HMI pin is used to clamp the lower limit of error amplifier output voltage and the minimum peak inductor current. This voltage is set by a 20 µA current source and the resistor, R4. Soft-Start Set the Soft-Start capacitor, C8 so that the output voltage ramps to its final value with a current between the hysteretic mode current and the rated current. The minimum value for C8 can be determined from: Larger values for C8 will extend the soft-start interval, TSOFT. Any loading during the Start-up mode lengthens TSOFT. Bypass and Filter Capacitors Capacitor C12 supplies the leading edge PWM current each switching cycle. A high quality (X7R dielectric ceramic) 0.1 µF surface-mount capacitor is recommended. Locate C12 directly across the VIN and PGND pins. Bypass the internal VCC supply with a high quality (X7R dielectric ceramic) surface-mount capacitor (C4). Locate C4 directly across the VCC and GND pins. The value for capacitor C5 should be selected as described in the Charge Pump Regulator above. A single high quality (X7R dielectric ceramic) capacitor is usually adequate. Some applications may need a high capacitance, electrolytic for charge-pump operation. For these applications, a high quality capacitor in parallel with the electrolytic is recommended. Locate C5 directly across the CP+ and CP- pins. R5 and C10 form a low-pass filter for the bias supply (VINF) of the reference and hysteretic comparator functions. A 2k Ω resistor for R5 and a 0.1 µF Capacitor for C10 is recommended. Locate C10 directly across the VINF and GND pins. Thermal Design The power ground (PGND) pins of the SOIC package provide a thermal conduction path for removing heat from the HIP5020. Inside the package, the HIP5020 die is mounted on a copper structure with connections to PGND (pins 6, 7, 8, 9, 20, 21, 22, and 23). Solder the SOIC to a circuit board with a copper ground plane to remove heat from the package. With good component layout and 3 square inches of copper ground plane, the junction-to- ambient thermal resistance is 36oC/W. Most of the converter’s power dissipation will be in the HIP5020 and the output inductor, L1. The power dissipated in the HIP5020 can be estimated from the converter’s full load efficiency and subtracting the inductor’s power dissipation ( ). The junction temperature rise above ambient is this power multiplied by the thermal resistance. Use the HIP5020 design and simulation software for more accurate thermal simulations. Be sure to keep the junction temperature below 125oC for reliable operation. Careful component layout and good thermal design maximized the efficiency and reliability of the converter. Detailed Characteristics Charge Pump Regulator The charge pump regulator supplies control power (VCC) to the internal functions of the HIP5020. The charge pump operates for input voltage levels below 9.8V and is disabled for input voltages above 9.8V. Figure 10 shows the charge pump output voltage (VCC) as a function of the input voltage (VIN). For input voltages below 9.8V nominally, the charge pump operates in two regions - as a voltage doubler and as a voltage regulator. The charge pump operates as a normal voltage doubler when VCC is below approximately 14.8V. The charge pump limits VCC to approximately 14.8V in the regulation region. For input voltages above 9.8V, the charge pump is disabled and VCC follows the input voltage less a diode drop. 0.01 0.1 1 10 80 85 90 95 100 LOAD CURRENT (A) 0.001 VHMI = 0.5V VHMI = 0.15V FIGURE 9. EFFICIENCY vs LOAD CURRENT 75 70 TA = 25 oC CIRCUIT 1: VIN = 6VDC C8 MIN T SOFT 10 5 – V REF --------------- • = where T SOFT C1 V O • 3A ---------------------- = IO 2 RDC • HIP5020 |
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