µPC7073

16

6.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the conditions recommended below.

For details of recommended soldering conditions, refer to the information document Semiconductor Device

Mounting Technology Manual (C10535E).

For soldering methods and conditions other than those recommended, please contact your NEC sales

representative.

SURFACE MOUNT TYPE

µPC7073GT: 48-pin plastic shrink SOP (375 mil)

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 235 ˚C

IR35-00-1

Duration: 30 sec. max. (210 ˚C or above)

Number of times: 1

Pin heating

Pin temperature: 300 ˚C max.

–

Duration: 3 sec. max. (per side of device)

Note

For the storage period after unpacking from the dry-pack, storage conditions are max. 25 ˚C, 65 % RH.