µPD17P228

22

Data Sheet U14542EJ1V0DS00

6.

RECOMMENDED SOLDERING CONDITIONS

For the

µPD17P228 soldering must be performed under the following conditions.

For details of recommended conditions for surface mounting, refer to information document "Semiconductor

Device Mounting Technology Manual" (C10535E).

For other soldering methods, please consult with NEC personnel.

Table 6-1. Soldering Conditions of Surface Mount Type

•

µPD17P228MC-5A4: 30-pin plastic SSOP (7.62 mm(300))

Soldering Method

Soldering Conditions

Symbol

Infrated Reflow

Package peak temperature: 235

°C, Time: 30 seconds max. (210°C min.),

IR35-103-2

Number of times: 2 max. Number of days: 3 (after that, prebaking is necessary

at 125

°C for 10 hours)

VPS

Package peak temperature: 215

°C, Time: 40 seconds max. (200°C min.),

VP15-103-2

Number of times: 2 max. Number of days: 3 (after that, prebaking is necessary

at 125

°C for 10 hours)

Wave soldering

Solder bath temperature: 260

°C max, Time: 10 seconds max., Number of times:

WS-60-103-1

once, preheating temperature: 120

°C max. (package surface temperature)

Number of days: 3 (after that, prebaking is necessary at 125

°C for 10 hours)

Partial heating

Pin temperature: 300

°C max., Time: 3 seconds max. (per side of device)

—

Note

Number of days in storage after the dry pack has been opened. The storage conditions are at 25

°C, 65%

RH MAX.

Caution Do not use two or more soldering methods in combination (except the partial heating method).