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AN4027 Datasheet(PDF) 24 Page - STMicroelectronics |
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AN4027 Datasheet(HTML) 24 Page - STMicroelectronics |
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24 / 41 page ![]() Functional check AN4027 24/41 DocID022604 Rev 3 . 4.4 Anti-capacitive mode protection The EVL6699-150W-SR demonstration board has been designed in such a way that the system does not work in capacitive mode during normal operation or failure conditions. As seen in Figure 27, even in dead short condition the LLC operates correctly in the inductive region, the same correct operation happens during load or input voltage transients. Normally, the resonant half bridge converter operates with the resonant tank current lagging behind the square-wave voltage applied by the half bridge leg, like a circuit having a reactance of an inductive nature. In this way the applied voltage and the resonant current have the same sign at every transition of the half bridge, which is a necessary condition in order for soft-switching to occur (zero-voltage switching, ZVS at turn-on for both MOSFETs). Therefore, should the phase relationship reverse, i.e. the resonant tank current leads the applied voltage, such as in circuits having a capacitive reactance, soft-switching would be lost. This is termed capacitive mode operation and must be avoided because of its significant drawbacks: 1. Both MOSFETs feature hard-switching at turn-on, like in conventional PWM-controlled converters (see Figure 14). The associated capacitive losses may be considerably higher than the total power normally dissipated under “soft-switching” conditions and this may easily lead to their overheating, as heatsinking is not usually sized to handle this abnormal condition. 2. The body diode of the MOSFET just switched off conducts current during the deadtime and its voltage is abruptly reversed by the other MOSFET turned on (see Figure 14). Therefore, the conducting body diode (which does not generally have great reverse recovery characteristics) keeps its low impedance until it recovers, and so originating a condition equivalent to a shoot-through of the half bridge leg. This is a potentially destructive condition (see point 3) and causes additional power dissipation due to the current and voltage of the conducting body diode simultaneously high during part of its recovery. 3. There is an extremely high reverse dv/dt (many tens of V/ns!) experienced by the conducting body diode at the end of its recovery with the other MOSFET turned on. This dv/dt may exceed the rating of the MOSFET and lead to an immediate failure because of the second breakdown of the parasitic BJT intrinsic in its structure. If Figure 28. Short-circuit - hiccup mode CH1: HB voltage CH2: DELAY CH3: CSS CH4: ISEN AM11630v1 |
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