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AN4163 Datasheet(PDF) 23 Page - STMicroelectronics |
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AN4163 Datasheet(HTML) 23 Page - STMicroelectronics |
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23 / 33 page ![]() DocID023658 Rev 2 23/33 AN4163 Thermal measurements 33 3 Thermal measurements In order to check the design reliability, a thermal mapping by means of an IR camera was done. Figure 42 and Figure 43 show thermal measurements of the on-board components at nominal input voltages and full load. Some pointers visible on the pictures placed across key components show the relevant temperature. Table 2 provides the correlation between the measured points and components, for both thermal maps. The ambient temperature during both measurements was 25 °C. According to these measurement results, all components of the board are working within their temperature limits. Figure 42. Thermal map at 115 Vac - 60 Hz - full load Figure 43. Thermal map at 230 Vac - 50 Hz - full load AM13427v1 AM13428v1 |
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